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STS Multiplex ICP Deep Reactive Ion Etch System (DRIE)
- Item No : 267206131345
- Condition : For parts or not working
- Brand : STS
- Seller : edi-online
- Current Bid : US $6750.00
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* Item Description
- The early 2000s STS Multiplex ICP Deep Reactive Ion Etch System (DRIE) is a highly specialized system used for deep silicon etching using the Bosch process. The STS ASE ICP DRIE is a load locked, inductively coupled plasma etch system that uses sulfur hexaflouride (SF6), octafluorocyclobutane (C4F8), oxygen (O2), and argon (Ar) process gases.
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