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3D Integration for VLSI Systems by Chuan Seng Tan (English) Hardcover Book
- Item No : 395954123550
- Condition : Brand New
- Brand : No brand Info
- Seller : grandeagleretail
- Current Bid : US $167.36
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* Item Description
- 3D Integration for VLSI Systems by Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester. Author Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester. Title 3D Integration for VLSI Systems. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.
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